Design and Analysis of Modified Cold Plate for Maximum Heat Transfer Rate

Author(s):

Gore Umesh Achyutrao , JSPM's Rajarshi Shahu College of Engineering,Pune; Kale Nikhil Kantaram, JSPM's Rajarshi Shahu College of Engineering,Pune; Khedkar Prashant Ranjit, JSPM's Rajarshi Shahu College of Engineering,Pune; Shinde Sunil Dattatray, JSPM's Rajarshi Shahu College of Engineering,Pune; Ajinkya R. Pawar, JSPM's Rajarshi Shahu College of Engineering,Pune

Keywords:

Liquid Cooling, Cold Plates, Temperature, Heat Transfer, Electronic Applications

Abstract:

For cooling electronic systems new techniques are invented. Cold plate is liquid cooling system used in electronic components. In present work, the modification is done in design of cold plate to reduce its cost and also to increase the heat dissipation rate. Water at various flow rates is supplied for given power inputs and heat removing capacity of each flow rate at that particular heat load is calculated. It is found that water is best working fluid for all flow rates. Methanol and acetone are best suited for high mass flow rates. The cold plate is used to provide a “cold wall” to which individual electronic components are mounted. The design and performance evaluation of a cold plate follows a prescribed procedure that depends on the heat loading and whether the heat loading is on one or two sides of the cold plate. Due to transmission of applied current and voltage sometimes the temperature of the circuit plate goes increasing. This temperature limits the electronic operation. Thus it is necessary to control such temperature, in order to maintain speed of electronic devices.

Other Details:

Manuscript Id	:	IJSTEV4I6030
Published in	:	Volume : 4, Issue : 6
Publication Date	:	01/01/2018
Page(s)	:	83-85

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