Thermal Analysis of Microchannels with Various Shapes of Dimples
Author(s):
Miss. Jagadale Vidyarani Ashok , Dr.D.Y.Patil School of engineering,Talegaon,Pune.; Mr. S. T. Kadam, Dr.D.Y.Patil School of Engineering,Talegaon,Pune; Mr. S. V. Jadhav, SVERIS,College of Engineering,Pandharpur
Keywords:
Convective Heat transfer, Convective Heat Transfer Coefficient, Micro- channels, Nusselts Number, Reynolds Number
Abstract:
The higher power density of modern electronic equipment posed a challenge of ever increasing heat removal requirement. Cooling of these equipment is essential in order to ensure their proper functioning. Microchannel heat sinks are considered to be one of the best solutions for this problem. Microchannel heat sink are investigated experimentally in terms of different thermal performance parameters like heat transfer coefficient and Nusselts number. Microchannel with four different dimple shapes viz circular, square, almond and elliptical, on their base are considered for their analysis. Experimental results show that dimpled microchannels perform better than microchannel without dimples. The elliptical dimples perform better than other dimple shapes.
Other Details:
| Manuscript Id | : | IJSTEV4I12069
|
| Published in | : | Volume : 4, Issue : 12
|
| Publication Date | : | 01/07/2018
|
| Page(s) | : | 158-165
|
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